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  • Flying Probe and In-circuit Testing​

    • Open, Shorts, Absence, Wrong, and Misoriented Parts

  • ​Digital CCA, Infrastructure and Parametric Testing

    • Infrastructure, Boundary Scan, and Programming
  • Functional Test
    • CCA-to-Subassembly-to-“Box Build”
    • Installation, Duplication, Design and Fabrication
    • Simple to Complex; Bench to Fully Automated Test Solutions – Concept to Production Readiness.
    • Hardware and Software Development​
    • Analog, Digital, Mixed Signals, RF (K / Ka), Optoelectronics
    • Fixtures, Interface Test Adapters, and Specialized Test Equipment
  • DIT-MCO, Cable and Harness Testing
  • Environmental Stress Screening (ESS)
  • Secure Testing

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  • Experienced RF and Mixed Signal Engineer Staff​

  • In-Circuit Test (Flying Probe, Boundary Scan, ICT)​

    • Agilent 3070 20MHz and 6Mhz Platforms
    • Teradyne Spectrum 8852E – 1600 Channels
    • Takaya Flying Probe
    • DITMCO – 10,000 points 
  • Test Systems Development
    • Boundary Scan
    • J-Tag
    • Digital Testing Analog/ Mixed Signal Testing​
    • RF Test Development up to 40 GHz
    • Gage R&R
  • Development Language & Software Tools
    • C, C++, LabView, Test Stand, Scan Works
    • Lab Windows/CVI, Fabmaster, Test Expert​